Granted Patent
Utility
US 5,817,446 · App. 08/732,565
Method of forming airbridged metallization for integrated circuit fabrication
Inventor:
Michael D. Lammert
Patented Case
View Patent ↗
Granted: Oct 6, 1998
Filed: Oct 15, 1996
Inventor
Michael D. Lammert
Assignee (at issue)
TRW Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.