Granted Patent
Utility
US 5,817,530 · App. 08/721,474
Use of conductive lines on the back side of wafers and dice for semiconductor interconnects
Inventor:
Michael B. Ball
Patented Case
View Patent ↗
Granted: Oct 6, 1998
Filed: Sep 27, 1996
Inventor
Michael B. Ball
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.