IP Library › Granted Patent US 5,821,763
Granted Patent Utility
US 5,821,763 · App. 08/754,869

Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof

Inventors: Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker
Patented Case View Patent ↗
Granted: Oct 13, 1998 Filed: Nov 22, 1996
Inventors
Brian S. Beaman
Keith E. Fogel
Paul A. Lauro
Maurice Heathcote Norcott
Da-Yuan Shih
George F. Walker
Assignee (at issue)
International Business Machines Corporation

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Quick Facts
Patent No.
US 5,821,763
App. No.
08/754,869
Filed
1996-11-22
Granted
1998-10-13
Kind
A