Granted Patent
Utility
US 5,829,689 · App. 08/788,498
Solder spreading apparatus
Inventors:
Okazaki Tadao, Maebara Yoshikazu
Patented Case
View Patent ↗
Granted: Nov 3, 1998
Filed: Jan 28, 1997
Inventors
Okazaki Tadao
Maebara Yoshikazu
Assignee (at issue)
Samsung Aerospace Industries, Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.