Granted Patent
Utility
US 5,833,758 · App. 08/754,596
Method for cleaning semiconductor wafers to improve dice to substrate solderability
Inventors:
Jack H. Linn, Mark A. Kwoka
Patented Case
View Patent ↗
Granted: Nov 10, 1998
Filed: Nov 20, 1996
Inventors
Jack H. Linn
Mark A. Kwoka
Assignee (at issue)
HARRIS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.