Granted Patent
Utility
US 5,834,366 · App. 08/914,469
Method for fabricating microbump interconnect for bare semiconductor dice
Inventor:
Salman Akram
Patented Case
View Patent ↗
Granted: Nov 10, 1998
Filed: Aug 19, 1997
Inventor
Salman Akram
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.