Granted Patent
Utility
US 5,834,834 · App. 08/347,662
Module mounting and adhesion systems and methods for electronic modules
Inventors:
Robert D. Lee, Steven N. Hass, Michael L. Bolan, Hal Kurkowski
Patented Case
View Patent ↗
Granted: Nov 10, 1998
Filed: Dec 1, 1994
Inventors
Robert D. Lee
Steven N. Hass
Michael L. Bolan
Hal Kurkowski
Assignee (at issue)
Dallas Semiconductor Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.