IP Library Granted Patent US 5,843,237
Granted Patent Utility
US 5,843,237 · App. 08/773,338

Apparatus for manufacturing a semiconductor device having a wafer loading stage with an annular slope

Inventor: Sang-Jun Chun
Patented Case View Patent ↗
Granted: Dec 1, 1998 Filed: Dec 26, 1996
Inventor
Sang-Jun Chun
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.

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Quick Facts
Patent No.
US 5,843,237
App. No.
08/773,338
Filed
1996-12-26
Granted
1998-12-01
Kind
A