Granted Patent
Utility
US 5,849,608 · App. 08/865,495
Semiconductor chip package
Inventor:
Masaaki Abe
Patented Case
View Patent ↗
Granted: Dec 15, 1998
Filed: May 29, 1997
Inventor
Masaaki Abe
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.