Granted Patent
Utility
US 5,850,356 · App. 08/713,495
Simulation apparatus for optimizing sputtering apparatus and simulation method therefor
Inventors:
Hiroaki Yamada, Toshiyuki Ohta, Toshiki Shinmura
Patented Case
View Patent ↗
Granted: Dec 15, 1998
Filed: Sep 13, 1996
Inventors
Hiroaki Yamada
Toshiyuki Ohta
Toshiki Shinmura
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.