Granted Patent
Utility
US 5,854,513 · App. 08/679,074
Semiconductor device having a bump structure and test electrode
Inventor:
Seong Jin Kim
Patented Case
View Patent ↗
Granted: Dec 29, 1998
Filed: Jul 12, 1996
Inventor
Seong Jin Kim
Assignee (at issue)
LG ELECTRONICS INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.