Granted Patent
Utility
US 5,854,741 · App. 08/651,200
Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same
Inventors:
Il Kwon Shim, Young Wook Heo
Patented Case
View Patent ↗
Granted: Dec 29, 1998
Filed: May 17, 1996
Inventors
Il Kwon Shim
Young Wook Heo
Assignees (at issue)
Amkor Electronics, Inc.
LP INDUSTRIES LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.