Granted Patent
Utility
US 5,856,691 · App. 08/802,354
Element-to-element interconnection in semiconductor device
Inventor:
Katsuki Hazama
Patented Case
View Patent ↗
Granted: Jan 5, 1999
Filed: Feb 21, 1997
Inventor
Katsuki Hazama
Assignee (at issue)
NIPPON STEEL CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.