Granted Patent
Utility
US 5,861,668 · App. 08/785,695
Semiconductor package
Inventor:
Gi Bon Cha
Patented Case
View Patent ↗
Granted: Jan 19, 1999
Filed: Jan 17, 1997
Inventor
Gi Bon Cha
Assignee (at issue)
LG Semicon Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.