IP Library Granted Patent US 5,861,674
Granted Patent Utility
US 5,861,674 · App. 08/027,491

Multilevel interconnection in a semiconductor device and method for forming the same

Inventor: Hiraku Ishikawa
Patented Case View Patent ↗
Granted: Jan 19, 1999 Filed: Feb 20, 1998
Inventor
Hiraku Ishikawa
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 5,861,674
App. No.
08/027,491
Filed
1998-02-20
Granted
1999-01-19
Kind
A