Granted Patent
Utility
US 5,863,813 · App. 08/917,004
Method of processing semiconductive material wafers and method of forming flip chips and semiconductor chips
Inventor:
Ross S. Dando
Patented Case
View Patent ↗
Granted: Jan 26, 1999
Filed: Aug 20, 1997
Inventor
Ross S. Dando
Assignee (at issue)
Micron Communications, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.