Granted Patent
Utility
US 5,864,175 · App. 08/644,491
Wrap-resistant ultra-thin integrated circuit package fabrication method
Inventor:
Carmen D. Burns
Patented Case
View Patent ↗
Granted: Jan 26, 1999
Filed: May 10, 1996
Inventor
Carmen D. Burns
Assignee (at issue)
Staktek Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.