Granted Patent
Utility
US 5,866,441 · App. 08/767,160
Inverted chip bonded module with high packaging efficiency
Inventor:
Benedict G. Pace
Patented Case
View Patent ↗
Granted: Feb 2, 1999
Filed: Dec 16, 1996
Inventor
Benedict G. Pace
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.