Granted Patent
Utility
US 5,866,469 · App. 08/662,390
Method of anodic wafer bonding
Inventor:
Kenneth Maxwell Hays
Patented Case
View Patent ↗
Granted: Feb 2, 1999
Filed: Jun 13, 1996
Inventor
Kenneth Maxwell Hays
Assignee (at issue)
Boeing North American, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.