Granted Patent
Utility
US 5,869,887 · App. 08/537,261
Semiconductor package fabricated by using automated bonding tape
Inventor:
Michitaka Urushima
Patented Case
View Patent ↗
Granted: Feb 9, 1999
Filed: Sep 29, 1995
Inventor
Michitaka Urushima
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.