Granted Patent
Utility
US 5,869,890 · App. 08/938,484
Insulation substrate for a semiconductor device
Inventors:
Masaharu Nishiura, Akira Morozumi, Tomio Shimizu, Katsumi Yamada, Shigemasa Saito
Patented Case
View Patent ↗
Granted: Feb 9, 1999
Filed: Sep 30, 1997
Inventors
Masaharu Nishiura
Akira Morozumi
Tomio Shimizu
Katsumi Yamada
Shigemasa Saito
Assignee (at issue)
FUJI ELECTRIC CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.