Granted Patent
Utility
US 5,871,808 · App. 08/977,340
Method for preserving solder paste in the manufacturing of printed circuit board assemblies
Inventor:
Curtis C. Thompson, Sr.
Patented Case
View Patent ↗
Granted: Feb 16, 1999
Filed: Nov 24, 1997
Inventor
Curtis C. Thompson, Sr.
Assignee (at issue)
MCMS Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.