Granted Patent
Utility
US 5,872,399 · App. 08/825,945
Solder ball land metal structure of ball grid semiconductor package
Inventor:
Moo Eung Lee
Patented Case
View Patent ↗
Granted: Feb 16, 1999
Filed: Apr 1, 1997
Inventor
Moo Eung Lee
Assignees (at issue)
ASemiconductor, Inc.
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.