Granted Patent
Utility
US 5,874,774 · App. 08/768,244
Flat package semiconductor device
Inventor:
Yoshikazu Takahashi
Patented Case
View Patent ↗
Granted: Feb 23, 1999
Filed: Dec 17, 1996
Inventor
Yoshikazu Takahashi
Assignee (at issue)
FUJI ELECTRIC CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.