Granted Patent
Utility
US 5,874,780 · App. 08/686,550
Method of mounting a semiconductor device to a substrate and a mounted structure
Inventor:
Tomoo Murakami
Patented Case
View Patent ↗
Granted: Feb 23, 1999
Filed: Jul 26, 1996
Inventor
Tomoo Murakami
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.