Granted Patent
Utility
US 5,883,438 · App. 08/854,069
Interconnection structure for attaching a semiconductor to substrate
Inventor:
Dae Soon Kang
Patented Case
View Patent ↗
Granted: Mar 16, 1999
Filed: May 8, 1997
Inventor
Dae Soon Kang
Assignee (at issue)
LG Semicon Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.