IP Library Granted Patent US 5,885,853
Granted Patent Utility
US 5,885,853 · App. 07/979,552

Hollow chip package and method of manufacture

Inventor: William Hamburgen
Patented Case View Patent ↗
Granted: Mar 23, 1999 Filed: Nov 18, 1992
Inventor
William Hamburgen
Assignee (at issue)
Digital Equipment Corporation

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Quick Facts
Patent No.
US 5,885,853
App. No.
07/979,552
Filed
1992-11-18
Granted
1999-03-23
Kind
A