Granted Patent
Utility
US 5,889,326 · App. 08/804,977
Structure for bonding semiconductor device to substrate
Inventor:
Kei Tanaka
Patented Case
View Patent ↗
Granted: Mar 30, 1999
Filed: Feb 27, 1997
Inventor
Kei Tanaka
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.