Granted Patent
Utility
US 5,894,170 · App. 08/912,067
Wiring layer in semiconductor device
Inventor:
Hiraku Ishikawa
Patented Case
View Patent ↗
Granted: Apr 13, 1999
Filed: Aug 15, 1997
Inventor
Hiraku Ishikawa
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.