Granted Patent
Utility
US 5,895,232 · App. 08/888,850
Three-dimensional warp-resistant integrated circuit module method and apparatus
Inventor:
Carmen D. Burns
Patented Case
View Patent ↗
Granted: Apr 20, 1999
Filed: Jul 7, 1997
Inventor
Carmen D. Burns
Assignee (at issue)
Staktek Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.