Granted Patent
Utility
US 5,897,334 · App. 08/951,062
Method for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boards
Inventors:
Sun Ho Ha, Young Wook Heo, Byung Joon Han
Patented Case
View Patent ↗
Granted: Apr 27, 1999
Filed: Oct 15, 1997
Inventors
Sun Ho Ha
Young Wook Heo
Byung Joon Han
Assignees (at issue)
Anam Semiconductor
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.