Granted Patent
Utility
US 5,897,337 · App. 08/533,205
Process for adhesively bonding a semiconductor chip to a carrier film
Inventors:
Keiichiro Kata, Shuichi Matsuda
Patented Case
View Patent ↗
Granted: Apr 27, 1999
Filed: Sep 25, 1995
Inventors
Keiichiro Kata
Shuichi Matsuda
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.