Granted Patent
Utility
US 5,897,707 · App. 08/935,772
Apparatus for applying solder paste to contact elements of ball grid array components
Inventor:
Hans-Werner Lueckehe
Patented Case
View Patent ↗
Granted: Apr 27, 1999
Filed: Sep 23, 1997
Inventor
Hans-Werner Lueckehe
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.