Granted Patent
Utility
US 5,899,705 · App. 09/070,066
Stacked leads-over chip multi-chip module
Inventor:
Salman Akram
Patented Case
View Patent ↗
Granted: May 4, 1999
Filed: Apr 30, 1998
Inventor
Salman Akram
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.