Granted Patent
Utility
US 5,899,745 · App. 08/887,695
Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor
Inventors:
Sung-Cheol Kim, Lei Ping Lai, Rajeev Bajaj, Adam W. Manzonie
Patented Case
View Patent ↗
Granted: May 4, 1999
Filed: Jul 3, 1997
Inventors
Sung-Cheol Kim
Lei Ping Lai
Rajeev Bajaj
Adam W. Manzonie
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.