Granted Patent
Utility
US 5,900,738 · App. 08/735,811
Contact structure device for interconnections, interposer, semiconductor assembly and package using the same and method
Inventors:
Igor Y. Khandros, Gaetar L. Mathieu
Patented Case
View Patent ↗
Granted: May 4, 1999
Filed: Oct 21, 1996
Inventors
Igor Y. Khandros
Gaetar L. Mathieu
Assignee (at issue)
FormFactor, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.