Granted Patent
Utility
US 5,901,065 · App. 08/597,768
Apparatus and method for automatically placing ties and connection elements within an integrated circuit
Inventors:
Mohan Guruswamy, Daniel Dulitz, Robert L. Maziasz
Patented Case
View Patent ↗
Granted: May 4, 1999
Filed: Feb 7, 1996
Inventors
Mohan Guruswamy
Daniel Dulitz
Robert L. Maziasz
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.