Granted Patent
Utility
US 5,901,901 · App. 08/802,134
Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly
Inventors:
Manfred Schneegans, Holger Huebner
Patented Case
View Patent ↗
Granted: May 11, 1999
Filed: Feb 19, 1997
Inventors
Manfred Schneegans
Holger Huebner
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.