Granted Patent
Utility
US 5,904,504 · App. 09/025,911
Die attach method and integrated circuit device
Inventor:
Howard Allen
Patented Case
View Patent ↗
Granted: May 18, 1999
Filed: Feb 19, 1998
Inventor
Howard Allen
Assignee (at issue)
FAIRCHILD SEMICONDUCTOR CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.