Granted Patent
Utility
US 5,906,532 · App. 08/504,011
Method for polishing semiconductor substrate and apparatus for the same
Inventors:
Tsutomu Nakajima, Yoshihiro Hayashi
Patented Case
View Patent ↗
Granted: May 25, 1999
Filed: Jul 19, 1995
Inventors
Tsutomu Nakajima
Yoshihiro Hayashi
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.