Granted Patent
Utility
US 5,907,477 · App. 08/814,206
Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant
Inventors:
Mark E. Tuttle, Rickie C. Lake, Joe Mousseau, Clay L. Cirino
Patented Case
View Patent ↗
Granted: May 25, 1999
Filed: Mar 11, 1997
Inventors
Mark E. Tuttle
Rickie C. Lake
Joe Mousseau
Clay L. Cirino
Assignee (at issue)
Micron Communications, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.