Granted Patent
Utility
US 5,907,769 · App. 08/774,609
Leads under chip in conventional IC package
Inventor:
David J. Corisis
Patented Case
View Patent ↗
Granted: May 25, 1999
Filed: Dec 30, 1996
Inventor
David J. Corisis
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.