Granted Patent
Utility
US 5,909,637 · App. 08/717,315
Copper adhesion to a diffusion barrier surface and method for same
Inventors:
Lawrence J. Charneski, Tue Nguyen
Patented Case
View Patent ↗
Granted: Jun 1, 1999
Filed: Sep 20, 1996
Inventors
Lawrence J. Charneski
Tue Nguyen
Assignees (at issue)
Sharp Microelectronics Technology Inc.
SHARP KABUSHIKI KAISHA
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.