Granted Patent
Utility
US 5,909,839 · App. 08/857,159
Method for dispensing solder paste on a non-planar substrate using an array of ultrasonically agitated pins
Inventors:
Robert Edward Belke, John Trublowski, Michael George Todd
Patented Case
View Patent ↗
Granted: Jun 8, 1999
Filed: May 15, 1997
Inventors
Robert Edward Belke
John Trublowski
Michael George Todd
Assignee (at issue)
Ford Motor Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.