Granted Patent
Utility
US 5,910,334 · App. 08/991,685
Method of manufacture for a thick film multi-layer circuit
Inventors:
Frans Lautzenhiser, John K. Isenberg, James E. Walsh, Adam W. Schubring
Patented Case
View Patent ↗
Granted: Jun 8, 1999
Filed: Dec 16, 1997
Inventors
Frans Lautzenhiser
John K. Isenberg
James E. Walsh
Adam W. Schubring
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.