Granted Patent
Utility
US 5,912,502 · App. 09/041,505
Wafer having a plurality of IC chips having different sizes formed thereon
Inventor:
Isao Kano
Patented Case
View Patent ↗
Granted: Jun 15, 1999
Filed: Mar 12, 1998
Inventor
Isao Kano
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.