Granted Patent
Utility
US 5,914,280 · App. 08/771,944
Deep trench etch on bonded silicon wafer
Inventor:
Peter Victor Gelzinis
Patented Case
View Patent ↗
Granted: Jun 22, 1999
Filed: Dec 23, 1996
Inventor
Peter Victor Gelzinis
Assignee (at issue)
HARRIS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.