Granted Patent
Utility
US 5,914,535 · App. 09/008,457
Flip chip-on-flip chip multi-chip module
Inventor:
Scott D. Brandenburg
Patented Case
View Patent ↗
Granted: Jun 22, 1999
Filed: Jan 16, 1998
Inventor
Scott D. Brandenburg
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.