IP Library Granted Patent US 5,918,150
Granted Patent Utility
US 5,918,150 · App. 08/729,567

Method for a chemical vapor deposition of copper on an ion prepared conductive surface

Inventors: Tue Nguyen, Jer-Shen Maa
Patented Case View Patent ↗
Granted: Jun 29, 1999 Filed: Oct 11, 1996
Inventors
Tue Nguyen
Jer-Shen Maa
Assignees (at issue)
Sharp Microelectronics Technology Inc.
SHARP KABUSHIKI KAISHA

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Quick Facts
Patent No.
US 5,918,150
App. No.
08/729,567
Filed
1996-10-11
Granted
1999-06-29
Kind
A