IP Library › Granted Patent US 5,920,118
Granted Patent Utility
US 5,920,118 · App. 08/992,259

Chip-size package semiconductor

Inventor: Byoung Sik Kong
Patented Case View Patent ↗
Granted: Jul 6, 1999 Filed: Dec 17, 1997
Inventor
Byoung Sik Kong
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.

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Quick Facts
Patent No.
US 5,920,118
App. No.
08/992,259
Filed
1997-12-17
Granted
1999-07-06
Kind
A